Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => 1 ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => 1 ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 200 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.25 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => >380C ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.0026 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => <0.1 ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 1.8 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => 0.7 (4.1) ) [tg] => Array ( [value] => 200°C ) [td] => Array ( [value] => 380°C ) )

TerraGreen<sup>®</sup> 400GE

TerraGreen^® 400GE

Halogen-free, Ultra Low Loss Material

TerraGreen® 400GE laminate materials are our most advanced ultra-high speed, halogen free ultra-low loss design solution.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 200°C Td: 380°C	Dk: 3.29 Df: 0.0026	IPC-4101 /134 UL - File Number E41625

Thermal Performance

Tg: 200°C
Td: 380°C

Electrical Performance

Dk: 3.29
Df: 0.0026

Industry Approvals

IPC-4101 /134

UL - File Number E41625

TerraGreen® 400GE is our Halogen Free material solution for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications with data rates >100 Gb/s. Our novel resin system, RTF3 (<2.5 µm Rz JIS) copper foil and e-glass is our lowest cost member of the TerraGreen 400G® family of products.

The TerraGreen® 400GE resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength.

TerraGreen® 400GE is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen® 400GE meets UL94 V-0.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- CAF resistant
- Low moisture absorption
- Halogen free
- 6x 260°C reflow capable
- 6x 288°C solder float capable

Processing Advantages
- FR-4 process compatible
- Excellent Fill and Flow
- Multiple lamination cycles
- HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia

Product Availability

Standard Material Offering: Laminate
- 2 to 10 mil (0.05 to 0.25 mm)

Copper Foil Type
- HVLP3 (VLP1) ≤1.1 micron Rz JIS
- Advanced RTF ≤2.5 micron Rz JIS

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging

Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		200	°C	2.4.25C
Glass Transition Temperature (Tg) by DMA		215	°C	2.4.24.4
Glass Transition Temperature (Tg) by TMA		180	°C	2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss		>380C	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T288 B. T300	60+	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	37 170 1.8	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE		12/13	ppm/°C	2.4.24C
Thermal Conductivity		0.54	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 10 GHz B. @ 20 GHz	3.29 3.25	—	2.5.5.5
Df, Loss Tangent	A. @ 10 GHz B. @ 20 GHz	0.0026	—	2.5.5.5
Volume Resistivity	C-96/35/90	2.0x10⁸	MΩ-cm	2.5.17.1
Surface Resistivity	C-96/35/90	2.0x10⁷	MΩ	2.5.17.1
Dielectric Breakdown		70	kV	2.5.6B
Arc Resistance		180	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		67 (1700)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		2 (250-499)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low profile and very low profile copper foil B. Low profile and very low profile copper foil ... After thermal stress	0.7 (4.1)	N/mm (lb/inch)	2.4.8C 2.4.8.2A
Flexural Strength	A. Length direction B. Cross direction	393 (57) 338 (49)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	220 (32) 193 (28)	MPa (kpsi)	ASTM D3039
Young's Modulus	A. Length direction B. Cross direction	14.5 (2100) 13.0 (1900)	GPa(kpsi)	ASTM D790-15e2
Flexural Modulus	A. Lengthwise B. Crosswise	12.1 (1750) 11.7(1700)	GPa (kpsi)	ASTM D790-15e2
Moisture Absorption		<0.1	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		140	°C	UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 1/23
B: Corrected units for Youngs Modulus from MPa to GPa - 1/24
C: Corrected laminate thickness offering from maximum 18 mils to 10 mils, updated copper foil offering - 3/24

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Construction	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	10 GHz	15 GHz	20 GHz	30 GHz
Construction	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x1035	63.5%	Standard	0.0020	0.051	3.37 0.0026	3.36 0.0026	3.35 0.0026	3.34 0.0026
1x1035	66.5%	Standard	0.0023	0.058	3.32 0.0026	3.31 0.0026	3.30 0.0026	3.29 0.0026
1x1035	69.5%	Standard	0.0025	0.064	3.27 0.0026	3.26 0.0026	3.25 0.0026	3.24 0.0026
1x1078	61.0%	Standard	0.0030	0.076	3.41 0.0026	3.40 0.0026	3.39 0.0026	3.38 0.0026
1x1078	65.5%	Standard	0.0035	0.089	3.33 0.0026	3.32 0.0026	3.31 0.0026	3.30 0.0026
2x1035	63.5%	Standard	0.0040	0.102	3.37 0.0026	3.36 0.0026	3.35 0.0026	3.34 0.0026
1x3313	53.0%	Standard	0.0040	0.102	3.56 0.0027	3.55 0.0027	3.54 0.0027	3.53 0.0027
2x1035	66.5%	Standard	0.0045	0.114	3.32 0.0026	3.31 0.0026	3.30 0.0026	3.29 0.0026
2x1035	69.5%	Standard	0.0050	0.127	3.27 0.0026	3.26 0.0026	3.25 0.0026	3.24 0.0026
1x2116	52.0%	Standard	0.0050	0.127	3.58 0.0027	3.57 0.0027	3.56 0.0027	3.55 0.0027
2x1078	61.0%	Standard	0.0060	0.152	3.41 0.0026	3.40 0.0026	3.39 0.0026	3.38 0.0026
2x1078	65.5%	Standard	0.0070	0.178	3.33 0.0026	3.32 0.0026	3.31 0.0026	3.30 0.0026
2x3313	53.0%	Standard	0.0080	0.203	3.56 0.0027	3.55 0.0027	3.54 0.0027	3.53 0.0027

Prepreg Data

Glass	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	10 GHz	15 GHz	20 GHz	30 GHz
Glass	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1035	63.5%	Standard	0.0020	0.051	3.37 0.0026	3.36 0.0026	3.35 0.0026	3.34 0.0026
1035	66.5%	Standard	0.0023	0.058	3.32 0.0026	3.31 0.0026	3.30 0.0026	3.29 0.0026
1035	69.5%	Standard	0.0025	0.064	3.27 0.0026	3.26 0.0026	3.25 0.0026	3.24 0.0026
1035	72.5%	Standard	0.0028	0.071	3.22 0.0025	3.21 0.0025	3.20 0.0025	3.19 0.0025
1078	61.0%	Standard	0.0030	0.076	3.41 0.0026	3.40 0.0026	3.39 0.0026	3.38 0.0026
1078	65.5%	Standard	0.0035	0.089	3.33 0.0026	3.32 0.0026	3.31 0.0026	3.30 0.0026
1078	69.5%	Standard	0.0040	0.102	3.27 0.0026	3.26 0.0026	3.25 0.0026	3.24 0.0026
1078	72.0%	Standard	0.0044	0.112	3.23 0.0025	3.22 0.0025	3.21 0.0025	3.20 0.0025
3313	58.0%	Standard	0.0046	0.117	3.47 0.0027	3.46 0.0027	3.45 0.0027	3.44 0.0027
3313	62.0%	Standard	0.0053	0.133	3.39 0.0026	3.38 0.0026	3.37 0.0026	3.36 0.0026
2116	58.5%	Standard	0.0060	0.152	3.45 0.0026	3.44 0.0026	3.43 0.0026	3.42 0.0026
2116	61.5%	Standard	0.0065	0.165	3.40 0.0026	3.39 0.0026	3.38 0.0026	3.37 0.0026

NOTE

Revisions:
A-Original-3/23
B-Adjusted RC%, Dk and Df values to match test data -7/23
All TerraGreen 400GE glass is Spread Weave in both directions
Standard-Commonly available
Alternate-Available, but not stocked

Documentation ▼

Resource Title & Summary	Date Updated
TerraGreen® 400G Prepreg Safety Data Sheet	01/22/2024
TerraGreen® 400G Laminate Safety Data Sheet	08/23/2024
TerraGreen® 400GE Processing Guide	09/02/2022
TerraGreen 400G Prepreg RoHS Declaration	03/20/2024
TerraGreen 400G Laminate RoHS Declaration	03/20/2024
TerraGreen® 400G Laminate Supplemental	03/20/2024
TerraGreen® 400G Prepreg Supplemental	03/20/2024

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Property		TerraGreen^® 400GE
Recommended for New Design
Halogen Free
Glass Transition Temperature (Tg) by DSC	Resin Content	200
Dk, Permittivity	Resin Content	3.25
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	>380C
Df, Loss Tangent	Resin Content	0.0026
Moisture Absorption	Resin Content	<0.1
Z-Axis CTE	50 to 260°C, (Total Expansion)	1.8
Peel Strength	Standard profile copper >>> After thermal stress	0.7 (4.1)

TerraGreen® 400GE

Halogen-free, Ultra Low Loss Material

TerraGreen® 400GE laminate materials are our most advanced ultra-high speed, halogen free ultra-low loss design solution.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

Add a Product to Compare to TerraGreen® 400GE

Contact Our Team For Product Information

TerraGreen^® 400GE

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