Stackup Editor
Zoom:
Hybrid
Design
Shield: Mask: Length unit: Pressed thickness:
Signal Layers Properties
Freq
(GHz)
LayerWidth(W)
Spacing(S)		RefZoDiff
Zo		TPD

DISCLAIMER

All Rights Reserved. The contents and design of this website including but not limited to, text, images, graphics, sound files, animation files, video files and their arrangement are the intellectual property of Isola Group, SARL. You may not use or reproduce any trademarks for any reason. Further, these objects, including trademarks, may not be copied or reproduced for commercial use or distribution, nor may these objects be modified or reposted to other sites.

Please do not share usernames or passwords, Isola Group will terminate user accounts that are considered to have been compromised or used by companies not registered in our database. In no event will Isola Group, SARL be liable for any loss or damage whatsoever arising out of, or in connection with, the use of isoStack and/or isoDesign Studio. Moreover, Isola Group, SARL makes no representation or warranties that circuit boards built using these tools will function as desired.

Links to external, or third party websites, are provided solely for visitors' convenience and are not under the control of Isola Group, SARL. Links taken to other sites are done so at your own risk and Isola Group, SARL accepts no liability for any linked sites or their content. Additionally, Isola Group, SARL has no control over the nature, content and availability of those sites. The inclusion of any links does not imply a recommendation or an endorsement Isola Group, SARL.

User Name [ Required ] :
Email [ Required ] :
Password [ Required ] :

Password should contains at least one Uppercase, one Lowercase, one Digit and one special Character.
Password should be at least 8 characters long.
Confirm Password [ Required ] :
First Name [ Required ] :
Last Name [ Required ] :
Company Name [ Required ] :
Company URL :
Company Postal Code :
Country [ Required ] :
Type of Business [ Required ] :
I agree to Isola's Terms & Condition and Privacy Policy
Registered Email[ Required ] :
Please enter your register email address. A new password will reset and send to your register email id.
Please enter your username and temporary password, which is send to your email address.
Username [ Required ] :
Temporary Password [ Required ] :
Please enter your desire password. Password can contain only letter and digit
New Password [ Required ] :
Re-enter New Password [ Required ] :
Username [ Required ] :
Password [ Required ] :
Enter Design Name [ Required ] :
Select Resin System [ Required ] :
Select the type of stackup :
Foil
Core Cap
How many copper layers:
Layers
Inner layer default copper weight:
Outer layer default copper weight:
Length unit :
mils / inches
mm
um
Set Copper weight:
Set Copper Filling:
%
Set Copper Plating:
Prepreg thickness after fill into copper layer :
Warning Prepreg may be too thin.
Minimum Pressed Thickness :
Enter desired mask thickness:
NOTE : Min Thickness is 0.1 mils or 0.00254 mm or 2.54 um.
Select Type:
Standard
Photo-imaged
Dry-film
Enter desired thickness :
NOTE : Min Thickness is 0.1 mils or 0.00254 mm or 2.54 um.
Select Type:
Gold
Silver
Solder Tin
Parameters
Micro Strip
WH1HTS
0.0005 mils
0.000 mils
0.000 mils
0.000 mils
0.0010 mils

Average DK / ∈ r :0.00
Constraints
0 < T/H < 0.2
0 < W/H < 20
NOTE : Formulas from IPC-2141A Design Guide for High-Speed Controlled Impedance Circuit Board.
Warning Are you sure to logout ?
First Name [ Required ] :
Last Name [ Required ] :
Company Name [ Required ] :
Company URL :
Company Postal Code :
Country [ Required ] :
Type of Business [ Required ] :
Current Password [ Required ] :
Please enter your desire password. Password can contain only letter, digits , _ , - and @ .
New Password [ Required ] :
Re-enter New Password [ Required ] :
Warning