IS550H

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IS550H

Halogen Free, High Reliability Laminate and Prepreg

IS550H is our Halogen Free laminate solution for high power & voltage applications that require extreme thermal stability.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 200°C Td: 400°C	Dk: 4.43 Df: 0.016	IPC-4101 /140 UL - File Number E41625

Thermal Performance

Tg: 200°C
Td: 400°C

Electrical Performance

Dk: 4.43
Df: 0.016

Industry Approvals

IPC-4101 /140

UL - File Number E41625

IS550H was developed in conjunction with a consortium of industry experts for high power & high voltage applications and PEV & HEV automotive electrification. The resulting solution addresses critical application needs for use in a harsh environment where very demanding, long term thermal reliability performance, extreme thermal cycling and very high voltage CAF & electro-migration resistance is required.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- CAF resistant
- Low moisture absorption
- Lead-free assembly compatible
- Halogen free
- 6x 260°C reflow capable
- 6x 288°C solder float capable

Production & Manufacturing

Currently manufactured in Asia

Product Availability

Standard Material Offering: Laminate
- 2 to 59 mil (0.05 to 1.5 mm)

Copper Foil Type
- RTF (Reverse Treat Foil)

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Heavier copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging

Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		200	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss		400	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	>60	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	38 210 2.2	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE	Pre-Tg	13-17	ppm/°C	2.4.24C
Thermal Conductivity		0.7	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 2 GHz B. @ 5 GHz C. @ 10 GHz	4.50 4.43 4.43	—	2.5.5.5
Df, Loss Tangent	A. @ 2 GHz B. @ 5 GHz C. @ 10 GHz	0.014 0.014 0.016	—	2.5.5.5
Volume Resistivity	A. C-96/35/90 B. At elevated temperature	5.2 x 10⁷ 3.2 x 10⁸	MΩ-cm	2.5.17.1
Surface Resistivity	A. C-96/35/90 B. At elevated temperature	1.0 x 10⁸ 3.9 x 10⁸	MΩ	2.5.17.1
Dielectric Breakdown		60	kV	2.5.6B
Arc Resistance		>160	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		46.9(1190)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		3	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF)	1.45 (8.2) 1.35(7.6)	N/mm (lb/inch)	2.4.8.2A 2.4.8.3
Flexural Strength	A. Length direction B. Cross direction	420 (60.9) 350 (50.8)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	214 (31) 186 (27)	MPa (kpsi)	ASTM D3039
Young's Modulus	A. Length direction B. Cross direction	28730 (4167) 24841 (3603)	MPa (ksi)	ASTM D790-15e2
Poisson's Ratio	A. Length direction B. Cross direction	0.174 0.151	—	ASTM D3039
Moisture Absorption		0.25	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		150	°C	UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 9/19

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Constructions	Resin Content %	Standard/ Alternate	Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 GHz	2 GHz	5 GHz	10 GHz
Constructions	Resin Content %	Standard/ Alternate	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x1035	66.0%	Standard	0.0020	0.05	4.32 0.0120	4.26 0.0130	4.23 0.0140	4.16 0.0140	4.23 0.0170	4.17 0.0150
1x1080	62.0%	Standard	0.0030	0.08	4.40 0.0120	4.33 0.0130	4.30 0.0130	4.24 0.0140	4.30 0.0160	4.24 0.0150
1x3313	57.0%	Standard	0.0040	0.10	4.51 0.0120	4.43 0.0120	4.39 0.0120	4.34 0.0130	4.40 0.0160	4.33 0.0160
2x1035	66.0%	Standard	0.0040	0.10	4.32 0.0120	4.26 0.0130	4.23 0.0140	4.16 0.0140	4.23 0.0170	4.17 0.0150
1x3313	60.0%	Standard	0.0045	0.11	4.44 0.0120	4.37 0.0120	4.34 0.0130	4.28 0.0140	4.34 0.0160	4.28 0.0160
1x2116	55.0%	Standard	0.0050	0.13	4.56 0.0120	4.46 0.0120	4.43 0.0120	4.39 0.0130	4.44 0.0160	4.37 0.0160
2x1080	62.0%	Standard	0.0060	0.15	4.40 0.0120	4.33 0.0130	4.30 0.0130	4.24 0.0140	4.30 0.0160	4.24 0.0150
1x7628	44.0%	Standard	0.0074	0.19	4.83 0.0110	4.70 0.0100	4.65 0.0090	4.64 0.0120	4.67 0.0140	4.61 0.0160
1x7628	47.0%	Standard	0.0080	0.20	4.75 0.0110	4.63 0.0100	4.59 0.0100	4.57 0.0120	4.61 0.0150	4.54 0.0160
2x3313	57.0%	Standard	0.0080	0.20	4.51 0.0120	4.43 0.0120	4.39 0.0120	4.34 0.0130	4.40 0.0160	4.33 0.0160
2x2116	55.0%	Standard	0.0100	0.25	4.56 0.0120	4.46 0.0120	4.43 0.0120	4.39 0.0130	4.44 0.0160	4.37 0.0160
2x7628	44.0%	Standard	0.0148	0.37	4.83 0.0110	4.70 0.0100	4.65 0.0090	4.64 0.0120	4.67 0.0140	4.61 0.0160
2x7628	47.0%	Standard	0.0160	0.41	4.75 0.0110	4.63 0.0100	4.59 0.0100	4.57 0.0120	4.61 0.0150	4.54 0.0160
3x7628	44.0%	Standard	0.0220	0.56	4.83 0.0110	4.70 0.0100	4.65 0.0090	4.64 0.0120	4.67 0.0140	4.61 0.0160
4x7628	44.0%	Standard	0.0300	0.76	4.83 0.0110	4.70 0.0100	4.65 0.0090	4.64 0.0120	4.67 0.0140	4.61 0.0160
5x7628	47.0%	Standard	0.0390	0.99	4.75 0.0110	4.63 0.0100	4.59 0.0100	4.57 0.0120	4.61 0.0150	4.54 0.0160
6x7628	47.0%	Standard	0.0480	1.19	4.75 0.0110	4.63 0.0100	4.59 0.0100	4.57 0.0120	4.61 0.0150	4.54 0.0160
8x7628	44.0%	Standard	0.0590	1.50	4.83 0.0110	4.70 0.0100	4.65 0.0090	4.64 0.0120	4.67 0.0140	4.61 0.0160

Prepreg Data

Glass Style	Resin Content %	Standard/ Alternate	Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 GHz	2 GHz	5 GHz	10 GHz
Glass Style	Resin Content %	Standard/ Alternate	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1035	66.0%	Standard	0.0020	0.051	4.32 0.0120	4.26 0.0130	4.23 0.0140	4.16 0.0140	4.23 0.0150	4.17 0.0150
106	76.0%	Standard	0.0024	0.061	4.12 0.0130	4.08 0.0140	4.07 0.0150	3.97 0.0150	4.05 0.0150	3.99 0.0150
1035	75.0%	Standard	0.0028	0.071	4.14 0.0130	4.10 0.0140	4.09 0.0150	3.99 0.0150	4.07 0.0150	4.01 0.0150
1080	68.0%	Standard	0.0033	0.084	4.28 0.0130	4.22 0.0130	4.20 0.0140	4.12 0.0140	4.19 0.0150	4.13 0.0150
1080	72.0%	Standard	0.0039	0.099	4.20 0.0130	4.15 0.0140	4.13 0.0150	4.04 0.0150	4.12 0.0150	4.06 0.0150
3313	60.0%	Standard	0.0045	0.114	4.44 0.0120	4.37 0.0120	4.34 0.0130	4.28 0.0140	4.34 0.0150	4.28 0.0160
1080	77.0%	Alternate	0.0049	0.124	4.10 0.0130	4.07 0.0140	4.05 0.0160	3.95 0.0150	4.04 0.0150	3.98 0.0150
2116	55.0%	Standard	0.0050	0.127	4.56 0.0120	4.46 0.0120	4.43 0.0120	4.39 0.0130	4.44 0.0140	4.37 0.0160
2116	58.0%	Standard	0.0054	0.137	4.49 0.0120	4.41 0.0120	4.37 0.0120	4.32 0.0130	4.38 0.0150	4.31 0.0160
2116	62.0%	Alternate	0.0061	0.155	4.40 0.0120	4.33 0.0130	4.30 0.0130	4.24 0.0140	4.30 0.0150	4.24 0.0150
7628	47.0%	Standard	0.0079	0.201	4.75 0.0110	4.63 0.0100	4.59 0.0100	4.57 0.0120	4.61 0.0140	4.54 0.0160
7628	52.0%	Standard	0.0090	0.229	4.63 0.0110	4.53 0.0110	4.49 0.0110	4.45 0.0130	4.50 0.0140	4.44 0.0160

NOTE

Revisions:
A-Original-1/2021
B-Added 2x106 4 mil & 1x2116 4.5 mil cores and 106 80% RC prepreg - 8/21
C-Changed construction of 2 mil 1x106 to 1x1035 core, changed 4 mil 2x106 to 2x1035 core, changed 4.5 mil 1x2116 to 1x3313 core, added 7.4 mil 1x7628 and 14.8 mil 2x7828 core, removed 47 mil 6x7628 and 63 mil 8x7628 core. Removed 106 70% and 80% prepreg, added 1035 66%, 3313 60% and 2116 62%. Changed 1080 77% to alternate. - 6/23

Documentation ▼

Resource Title & Summary	Date Updated
IS550H Laminate Supplemental	03/20/2024
IS550H Prepreg Supplemental	03/20/2024
IS550H Prepreg RoHS Declaration	03/20/2024
IS550H Laminate RoHS Declaration	03/20/2024
IS550H Prepreg Safety Data Sheet	01/22/2024
IS550H Laminate Safety Data Sheet	02/26/2024
IS550H Processing Guide	01/14/2021

Resources

Presentation

Isola featured at OEM Forum “The Heat is On! Finding PCB Materials that Like It Hot!”

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

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Property		IS550H
Recommended for New Design
Halogen Free
Glass Transition Temperature (Tg) by DSC	Resin Content	200
Dk, Permittivity	Resin Content	4.43
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	400
Df, Loss Tangent	Resin Content	0.016
Moisture Absorption	Resin Content	0.25
Z-Axis CTE	50 to 260°C, (Total Expansion)	2.2
Peel Strength	Standard profile copper >>> After thermal stress	1.35(7.6)

IS550H

Halogen Free, High Reliability Laminate and Prepreg

IS550H is our Halogen Free laminate solution for high power & voltage applications that require extreme thermal stability.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

Add a Product to Compare to IS550H

Resources

Isola featured at OEM Forum “The Heat is On! Finding PCB Materials that Like It Hot!”

Laminate & Prepreg Manufacturing

Contact Our Team For Product Information