P96/P26

Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => 1 ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => — ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 260 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.73 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => 396 ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.021 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => 0.5 ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 1.5 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => 1.14 (6.5) ) [tg] => Array ( [value] => 260°C ) [td] => Array ( [value] => 396°C ) )

P96/P26

Polyimide UL V-0 Laminate and Prepreg

Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 260°C Td: 396°C	Dk: 3.76 Df: 0.017	IPC-4101 /40 /41 UL - File Number E41625

Thermal Performance

Tg: 260°C
Td: 396°C

Electrical Performance

Dk: 3.76
Df: 0.017

Industry Approvals

IPC-4101 /40 /41

UL - File Number E41625

These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- Lead-free assembly compatible

Processing Advantages
- Good flow and fill
- Multiple reflow capable

Production & Manufacturing

Currently manufactured in North America

Product Availability

Standard Material Offering: Laminate
- 2 to 125 mil (0.05 to 3.2 mm)

Copper Foil Type
- HTE Grade 3

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Heavier copper foil available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging

Glass Fabric Availability
- E-glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		260	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss		396	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	60	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. 50 to 260°C, (Total Expansion)	55 1.5	ppm/°C %	2.4.24C
X/Y-Axis CTE	Pre-Tg	13/14	ppm/°C	2.4.24C
Thermal Conductivity		0.4	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 100 MHz B. @ 500 MHz C. @ 1 GHz D. @ 2 GHz E. @ 5 GHz F. @ 10 GHz	3.83 3.80 3.78 3.76 3.73 3.73	—	2.5.5.9 2.5.5.9 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Df, Loss Tangent	A. @ 100 MHz B. @ 500 MHz C. @ 1 GHz D. @ 2 GHz E. @ 5 GHz F. @ 10 GHz	0.0135 0.0151 0.0172 0.0179 0.0188 0.021	—	2.5.5.9 2.5.5.9 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Volume Resistivity	A. After moisture resistance B. At elevated temperature	3.0 x 10⁸ 7.0 x 10⁸	MΩ-cm	2.5.17.1
Surface Resistivity	A. After moisture resistance B. At elevated temperature	3 x 10⁶ 2 x 10⁸	MΩ	2.5.17.1
Dielectric Breakdown		>55	kV	2.5.6B
Arc Resistance		130	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		44 (1100)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		4 (100-174)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions	1.14 (6.5) 1.25 (7.0) 1.25 (7.0) 1.14 (6.5)	N/mm (lb/inch)	2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3
Flexural Strength	A. Length direction B. Cross direction	576 (83.6) 383 (55.5)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	383 (55.5) 238 (35.4)	MPa (kpsi)	ASTM D3039
Young's Modulus	A. Length direction B. Cross direction	3958 3530	ksi	ASTM D790-15e2
Poisson's Ratio	A. Length direction B. Cross direction	0.189 0.154	—	ASTM D3039
Moisture Absorption		0.5	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		170	°C	UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Corrected MOT value to match UL file - 11/18 F: Updated RTI from 140 to 170 per UL rating - 3/24

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Construction	Resin Content %		Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 GHz	2 GHz	5 GHz	10 Ghz
Construction	Resin Content %		Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x106	70.0%	Alternate	0.0020	0.051	3.70 0.0150	3.60 0.0170	3.60 0.0200	3.60 0.0210	3.60 0.0240	3.60 0.0290
1x106	74.0%	Standard	0.0025	0.064	3.60 0.0160	3.60 0.0180	3.50 0.0200	3.50 0.0210	3.50 0.0250	3.50 0.0300
1x1080	61.0%	Standard	0.0030	0.076	3.80 0.0140	3.80 0.0160	3.80 0.0180	3.80 0.0190	3.70 0.0220	3.70 0.0260
2x106	66.0%	Standard	0.0035	0.089	3.70 0.0150	3.70 0.0160	3.70 0.0190	3.70 0.0200	3.60 0.0230	3.60 0.0280
1x2116	45.0%	Standard	0.0040	0.102	4.20 0.0120	4.20 0.0140	4.10 0.0160	4.10 0.0160	4.10 0.0190	4.10 0.0220
1x106/1x1080	58.0%	Alternate	0.0042	0.107	3.90 0.0130	3.80 0.0150	3.80 0.0170	3.80 0.0180	3.80 0.0210	3.80 0.2490
1x106/1x1080	62.0%	Standard	0.0045	0.114	3.80 0.0140	3.80 0.0160	3.80 0.0180	3.80 0.0190	3.70 0.0220	3.70 0.0260
1x106/1x1080	65.0%	Alternate	0.0050	0.127	3.80 0.0140	3.70 0.0160	3.70 0.0190	3.70 0.0200	3.70 0.0230	3.70 0.0270
2x1080	57.0%	Standard	0.0050	0.127	3.90 0.0130	3.80 0.0150	3.90 0.0170	3.80 0.0180	3.80 0.0210	3.80 0.2490
1x106/1x2113	53.0%	Standard	0.0053	0.135	4.00 0.0130	4.00 0.0150	3.90 0.0170	3.90 0.0170	3.90 0.0200	3.90 0.0240
1x106/1x2116	49.0%	Standard	0.0060	0.152	4.10 0.0130	4.00 0.0140	4.00 0.0160	4.00 0.0160	4.00 0.0190	4.00 0.0220
1x1080/1x2116	51.0%	Standard	0.0070	0.178	4.00 0.0130	4.00 0.0140	4.00 0.0160	4.00 0.0170	3.90 0.0200	3.90 0.0230
1x2113/1x2116	47.0%	Standard	0.0080	0.203	4.10 0.0120	4.10 0.0140	4.10 0.0160	4.10 0.0160	4.00 0.0190	4.00 0.0220
1x2113/1x2116	48.0%	Standard	0.0080	0.203	4.10 0.0120	4.10 0.0140	4.10 0.0160	4.00 0.0160	4.00 0.0190	4.00 0.0220
2x1080/1x2113	54.0%	Standard	0.0090	0.229	4.00 0.0130	3.90 0.0150	3.90 0.0170	3.90 0.0170	3.90 0.0200	3.90 0.0240
2x1080/2116	54.0%	Standard	0.0100	0.254	4.00 0.0130	3.90 0.0150	3.90 0.0170	3.90 0.0170	3.90 0.0200	3.90 0.0240
1x7628/2x1080	45.0%	Standard	0.0120	0.305	4.20 0.0120	4.20 0.0140	4.10 0.0160	4.10 0.0160	4.10 0.0190	4.10 0.0220
2x7628	39.0%	Standard	0.0140	0.356	4.30 0.0110	4.30 0.0120	4.20 0.0140	4.20 0.0140	4.20 0.0170	4.20 0.0190
2x7628/1x106	42.0%	Alternate	0.0160	0.406	4.00 0.0090	4.00 0.0090	4.00 0.0100	4.00 0.0110	4.00 0.0110	4.00 0.0110
2x7628/1x2113	41.0%	Alternate	0.0180	0.457	4.10 0.0090	4.10 0.0090	4.00 0.0100	4.00 0.0110	4.00 0.0110	4.00 0.0110
3x7628	38.0%	Alternate	0.0200	0.508	4.20 0.0110	4.20 0.0120	4.20 0.0140	4.20 0.0140	4.10 0.0170	4.10 0.0190
3x7628/1x2116	40.0%	Alternate	0.0240	0.610	4.30 0.0110	4.20 0.0120	4.20 0.0140	4.20 0.0150	4.20 0.0170	4.20 0.0200
4x7628	39.0%	Standard	0.0280	0.711	4.30 0.0110	4.30 0.0120	4.20 0.0140	4.20 0.0140	4.20 0.0170	4.20 0.0190
4x7628/1x2116	39.0%	Standard	0.0310	0.787	4.30 0.0110	4.30 0.0120	4.20 0.0140	4.20 0.0140	4.20 0.0170	4.20 0.0190
6x7628	36.0%	Standard	0.0390	0.991	4.30 0.0100	4.30 0.0120	4.30 0.0130	4.30 0.0140	4.30 0.0160	4.30 0.0180
1x2116/ 8x7628	38.0%	Alternate/OA	0.0590	1.499	4.30 0.0110	4.30 0.0120	4.30 0.0140	4.30 0.0140	4.20 0.0170	4.20 0.0190
9x7628	38.0%	Standard/Base	0.0590	1.499	4.30 0.0110	4.30 0.0120	4.30 0.0140	4.30 0.0140	4.20 0.0170	4.20 0.0190

Prepreg Data

Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 GHz	2 GHz	5 GHz	10 Ghz
Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
106	75.0%	0.0025	0.064	3.59 0.0156	3.55 0.0177	3.53 0.0205	3.50 0.0215	3.48 0.0255	3.48 0.0302
1080	65.0%	0.0032	0.081	3.76 0.0144	3.72 0.0163	3.70 0.0187	3.67 0.0195	3.66 0.0231	3.66 0.0272
2113	57.0%	0.0044	0.112	3.91 0.0135	3.87 0.0152	3.86 0.0173	3.83 0.0180	3.82 0.0211	3.82 0.0247
2116	54.0%	0.0052	0.132	3.97 0.0132	3.93 0.0147	3.92 0.0167	3.89 0.0174	3.88 0.0203	3.88 0.0238
7628	42.0%	0.0074	0.188	4.22 0.0115	4.19 0.0128	4.18 0.0145	4.17 0.0150	4.14 0.0175	4.14 0.0201

NOTE

Revisions:

A-Original-4/17

B-Modified construction offering 6/19

C-Corrected 31 mil core thickness 9/19

D-Corrected 18 mil 1x2113/2x7628 2/21

E-Added 0.059 0x7628 Base construction 6/22

F-Revised 9 mil construction to 2x1080/1x2113 from 2x2113/1x106 construction - 6/23
G-Corected 16 mil core construction from 2x7628/1080 to 2x7628/106 - 5-24
Standard-Commonly available with the best availability.

Alternate-Available, but not stocked with longer lead time

Documentation ▼

Resource Title & Summary	Date Updated
P26 Laminate Supplemental	03/20/2024
P96 Laminate Supplemental	03/20/2024
P96/P26 Processing Guide	06/30/2020
Isola Laminate Outgassing Data Properties	03/22/2024
P96 Laminate Safety Data Sheet	02/16/2021
P26 Prepreg Safety Data Sheet	02/16/2021
P26 Prepreg RoHs Declaration	03/20/2024
P96 Laminate RoHS Declaration	03/20/2024

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Property		P96/P26
Recommended for New Design
Halogen Free		—
Glass Transition Temperature (Tg) by DSC	Resin Content	260
Dk, Permittivity	Resin Content	3.73
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	396
Df, Loss Tangent	Resin Content	0.021
Moisture Absorption	Resin Content	0.5
Z-Axis CTE	50 to 260°C, (Total Expansion)	1.5
Peel Strength	Standard profile copper >>> After thermal stress	1.14 (6.5)

P96/P26

Polyimide UL V-0 Laminate and Prepreg

Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

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