Tachyon® 100G

Ultra Low Loss Laminate and Prepreg

Tachyon 100G laminate materials are designed for very high-speed digital applications up to and beyond data rates of 100 Gb/s.

Thermal Performance

Tg: 215°C
Td: 360°C

Electrical Performance

Dk: 3.02
Df: 0.0021

Industry Approvals

IPC-4103 /17
IPC-4101 /102
UL - File Number E41625

Tachyon 100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz. These electrical properties provide designers a scalable solution for next generation designs of backplanes and daughter cards, enabling 10x improvements from 10 Gb/s data rates.

Isola has developed Tachyon 100G with the highest level of thermal performance for high layer count line cards. The very low Z-axis CTE makes it a perfect choice for fine pitch BGA applications.  The material is optimized with the use of spread glass to mitigate skew, improve rise times, reduce jitter, and increase eye width/height and that use ultra smooth HVLP (VLP2) 2um Rz copper that significantly reduces conductor losses.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Low moisture absorption
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • Multiple lamination cycles
    • HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia, North America

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 20 mil (0.05 to 0.51 mm)
  • Copper Foil Type
    • HVLP3 (VLP1) ≤1.1 micron Rz JIS
    • HVLP (VLP2) ≤2.5 micron Rz JIS
    • Advanced RTF ≤2.5 micron Rz JIS
    • Embedded resistor foil
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • Low Dk Glass -Asahi Japan, Asahi Tawian, TGI Taiwan
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 215 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 230 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 210 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
C. T300
>60
>60
>20
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
250
2.5
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 15 ppm/°C 2.4.24C
Thermal Conductivity 0.42 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
3.04
3.02
3.02
2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.0021 2.5.5.5
Volume Resistivity C-96/35/90 1.33x107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33x105 2.5.17.1
Dielectric Breakdown 60 kV 2.5.6B
Arc Resistance 125 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 60 (1500) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175 -249) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile and very low profile copper foil
B. Low profile and very low profile copper foil ... After thermal stress
0.79 (4.5)

0.96 (5.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
Flexural Strength
A. Length direction
B. Cross direction
303 (44.0)
283 (41.0)
MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
207 (30.0)
172 (25.0)
MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
2,551
2,417
ksi ASTM D790-15e2
Taylor's Modulus
A. Length direction
B. Cross direction
2,264
2,197
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.165
0.156
ASTM D3039
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected moisture uptake value 6/18
C: Corrected units for Flexural and Tensile Strength - 8/18
D: Change MOT to RTI - 5/19
E: Changed VLP2 to HVLP to aligned with common industry terms 4/21
F: Changed TMA Tg to 210C, DSC Tg to 215C and DMA to 230C based on long term data 9/22
G: Added HVLP3, Advanced RTF and 2 ounce copper options, added 20 mil thickness option - 3/24

Core Data

Construction Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
1 GHz 2 Ghz 5 Ghz 10 GHz 15 Ghz 20 Ghz
1x1067 66.5% 0.0020 0.051 3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
1x1067 72.0% 0.0025 0.064 2.98
0.0014
2.98
0.0014
2.98
0.0014
2.98
0.0014
2.98
0.0014
2.98
0.0014
1x1078 66.0% 0.0030 0.076 3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
1x1078 70.5% 0.0035 0.089 3.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
1x3313 58.5% 0.0040 0.102 3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
2x1067 66.5% 0.0040 0.102 3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
2x1067 70.0% 0.0045 0.114 3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
1x3313 66.0% 0.0050 0.127 3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
1x2116 57.0% 0.0050 0.127 3.25
0.0018
3.25
0.0018
3.25
0.0018
3.25
0.0018
3.25
0.0018
3.25
0.0018
2x1067 72.5% 0.0050 0.127 2.98
0.0014
2.98
0.0014
2.98
0.0015
2.98
0.0015
2.98
0.0015
2.98
0.0015
2x1078 60.0% 0.0050 0.127 3.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
2x1078 63.0% 0.0055 0.140 3.15
0.0019
3.15
0.0019
3.15
0.0019
3.15
0.0019
3.15
0.0019
3.15
0.0019
2x1078 66.0% 0.0060 0.152 3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
2x1078 70.5% 0.0070 0.178 3.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
2x3313 58.5% 0.0080 0.203 3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
2x3313 63.5% 0.0090 0.226 3.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3x1078 68.5% 0.0100 0.254 3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
2x2116 57.0% 0.0100 0.254 3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
3x3313 58.5% 0.0120 0.305 3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3x3313 62.5% 0.0140 0.356 3.15
0.0020
3.15
0.0020
3.15
0.0020
3.15
0.0020
3.15
0.0020
3.15
0.0020
4x2116 57.0% 0.0200 0.508 3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
7x3313 58.5% 0.0280 0.711 3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
1 GHz 2 Ghz 5 Ghz 10 GHz 15 Ghz 20 Ghz
1035 69.0% 0.0020 0.051 3.06
0.0017
3.06
0.0017
3.06
0.0017
3.06
0.0017
3.06
0.0017
3.06
0.0017
1067 70.0% 0.0022 0.056 3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
106 76.0% 0.0023 0.058 2.95
0.0013
2.95
0.0013
2.95
0.0014
2.95
0.0014
2.95
0.0014
2.95
0.0014
1067 71.5% 0.0024 0.061 3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
1035 75.0% 0.0026 0.066 2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
1067 74.0% 0.0026 0.066 2.98
0.0014
2.98
0.0014
2.98
0.0015
2.98
0.0015
2.98
0.0015
2.98
0.0015
1067 76.5% 0.0029 0.074 2.94
0.0013
2.94
0.0013
2.94
0.0013
2.94
0.0013
2.94
0.0013
2.94
0.0013
1078 67.5% 0.0031 0.079 3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
1078 70.5% 0.0035 0.089 3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
1078 72.0% 0.0037 0.094 3.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
1080 72.0% 0.0038 0.097 3.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
3313 62.0% 0.0042 0.107 3.19
0.0014
3.19
0.0014
3.19
0.0014
3.19
0.0014
3.19
0.0014
3.19
0.0014
1078 75.0% 0.0042 0.107 2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
1080 75.0% 0.0043 0.109 2.97
0.0013
2.97
0.0013
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
1078 78.0% 0.0046 0.117 2.92
0.0020
2.92
0.0020
2.92
0.0020
2.92
0.0020
2.92
0.0020
2.92
0.0020
3313 63.5% 0.0046 0.117 3.16
0.0018
3.16
0.0018
3.16
0.0018
3.16
0.0018
3.16
0.0018
3.16
0.0018
3313 66.5% 0.0051 0.129 3.11
0.0021
3.11
0.0021
3.11
0.0021
3.11
0.0021
3.11
0.0021
3.11
0.0021
3313 69.5% 0.0055 0.140 3.05
0.0019
3.05
0.0019
3.05
0.0019
3.05
0.0019
3.05
0.0019
3.05
0.0019

NOTE

Revisions:
A - Original-4/17
B - Adjusted prepreg thickness values-6/18
C - Added Standard & Alternate construction-8/18;
D - Added 9 mil core 5/19
E - Optimized construction set 6/19
F - Clarified Weave and Offering, eliminated low Frequency data 1/20
G - Removed Weave Type 9/20
H - Removed Core: 2.5 mil 1x1035, 4.0 2x1035, 5.0 mil 1x1078, 10 mil 2x3313
Added Core: 2.5 mil 1x1067, 5.0 mil 1x2116, 5.5 mil 2x1078, 10.0 mil 2x2116, 28.0 mil 7x3313
Removed Prepreg: 1078 65%RC, 1078 78% RC

Added Prepreg: 3313 62% RC, 3313 69.5% RC
All Tachyon 100G glass is Spread Weave in both directions

Resources

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model

This presentation outlines practical fiber weave effect model for skew and jitter.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

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