TerraGreen® 400G (RF/MW)

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G laminate materials are our most advanced ultra high speed, halogen free ultra low loss design solutionnargap.

Thermal Performance

Tg: 200°C
Td: 380°C

Electrical Performance

Dk: 3.07
Df: 0.0018

Industry Approvals

IPC-4101 /134
UL - File E41625 Grade PCL-FR-370HR

TerraGreen® 400G (RF/MW) is our Halogen Free material solution for next generation 5G infrastructure and mmWave applications. Our novel resin system has been engineered for high data rates with excellent cost for loss performance.

TerraGreen® 400G (RF/MW) is lead free compatible and can be processed utilizing standard PCB equipment and processing steps.

TerraGreen® 400G (RF/MW) meets UL 94 V-0 and is halogen free.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • FR-4 process compatible
    • Excellent fill and flow for heavy copper
    • Multiple lamination cycles
    • HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 20 mil (0.05 to 0.51 mm)
  • Copper Foil Type
    • HVLP3 (VLP1) ≤1.1 micron Rz JIS
  • Copper Weight
    • ½, 1 oz (18 and 35 µm) available
  • Standard Material Offering: Prepreg
  • Glass Fabric Availability
    • Low Dk glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 215 2.4.24.4
Glass Transition Temperature (Tg) by TMA 180 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss >380 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) T288 60+ Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C.
37
170
1.8
ppm/°C 2.4.24C
X/Y-Axis CTE 12/13 ppm/°C 2.4.24C
Thermal Conductivity 0.54 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 5 GHz
B. @ 10 GHz
C. @ 20 GHz
3.07 2.5.5.5
Df, Loss Tangent
A. @ 5 GHz
B. @ 10 GHz
C. @ 20 GHz
0.0018 Bereskin Stripline
Peel Strength 0.7 (4.1) N/mm (lb/inch) 2.4.8C
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 140 °C
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Notes:
All data is preliminary and subject to chaange
* Data was developed using 55% RC rigid laminate

Revisions:
A: Preliminary Release
B-Corrected CTE data-5/24

Core Data

Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 GHz 15 GHz 20 GHz
0.0025 0.064 3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018
0.0050 0.127 3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018
0.0100 0.254 3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018
0.0200 0.508 3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018
3.07
0.0018

NOTE

***ALL DATA IS PRELIMINARY AND SUBJECT TO CHANGE AS ADDITIONAL DATA BECOMES AVAILABLE***

Revisions:
A-Original-4/17
All TerraGreen 400G glass is Spread Weave in both directions

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials

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