Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => 1 ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => 1 ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 200 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.07 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => >380 ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.0015 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => <0.1 ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 1.8 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => 0.7 (4.1) ) [tg] => Array ( [value] => 200°C ) [td] => Array ( [value] => 380°C ) )

TerraGreen<sup>®</sup> 400G2

TerraGreen^® 400G2

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G2 laminate materials are our most advanced ultra-high speed, halogen free extremely-low loss design solution.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 200°C Td: 380°C	Dk: 3.10 Df: 0.0015	IPC-4101 /134 UL - File Number E41625

Thermal Performance

Tg: 200°C
Td: 380°C

Electrical Performance

Dk: 3.10
Df: 0.0015

Industry Approvals

IPC-4101 /134

UL - File Number E41625

TerraGreen® 400G2 is our Halogen Free material solution for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications. Our novel resin system, ultra smooth HVLP3(VLP1) copper foil and 2nd generation Ultra Low Dk glass has been engineered for very high data rates of >100 Gb/s with excellent cost for loss performance.

The TerraGreen® 400G2 resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength.

TerraGreen® 400G2 is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen® 400G2 meets UL94 V-0.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- CAF resistant
- Low moisture absorption
- Halogen free
- 6x 260°C reflow capable
- 6x 288°C solder float capable

Processing Advantages
- FR-4 process compatible
- Excellent Fill and Flow
- Multiple lamination cycles
- HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia, North America, Europe

Product Availability

Standard Material Offering: Laminate
- 2 to 10 mil (0.05 to 0.25 mm)

Copper Foil Type
- HVLP3 (VLP1) ≤1.1 micron Rz JIS

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging

Glass Fabric Availability
- Very Low Dk glass
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		200	°C	2.4.25C
Glass Transition Temperature (Tg) by DMA		215	°C	2.4.24.4
Glass Transition Temperature (Tg) by TMA		180	°C	2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss		>380	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	60+	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	37 170 1.8	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE		12/13	ppm/°C	2.4.24C
Thermal Conductivity		0.54	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 10 GHz B. @ 20 GHz	3.10 3.07	—	2.5.5.5
Df, Loss Tangent	A. @ 10 GHz B. @ 20 GHz	0.0015	—	2.5.5.5
Volume Resistivity	C-96/35/90	2.0x10⁸	MΩ-cm	2.5.17.1
Surface Resistivity		2.0x10⁷	MΩ	2.5.17.1
Dielectric Breakdown		70	kV	2.5.6B
Arc Resistance		180	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		67 (1700)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		2 (250-499)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low profile and very low profile copper foil B. Low profile and very low profile copper foil ... After thermal stress	0.7 (4.1)	N/mm (lb/inch)	2.4.8C 2.4.8.2A
Flexural Strength	A. Length direction B. Cross direction	393 (57) 338 (49)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	220 (32) 193 (28)	MPa (kpsi)	ASTM D3039
Young's Modulus	A. Length direction B. Cross direction	14.5 (2100) 13.0 (1900)	GPa(kpsi)	ASTM D790-15e2
Flexural Modulus	A. Lengthwise B. Crosswise	12.1 (1750) 11.7 (1700)	GPa (kpsi)	ASTM D790-15e2
Poisson's Ratio	A. Length direction B. Cross direction	0.17 0.22	—	ASTM D3039
Moisture Absorption		<0.1	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		140	°C	UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Notes:
All data is preliminary and subject to change
* Data was developed using 55% RC rigid laminate

Revisions:
A: Preliminary Release 1/23
B: Corrected units for Youngs Modulus from MPa to GPa - 1/24
C: Corrected laminate thickness offering from maximum 18 mils to 10 mils, updated copper foil offering - 3/24

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Construction	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	10 GHz	15 GHz	20 GHz	30 GHz	30 GHz D
Construction	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x1035	67.0%	Standard	0.0020	0.051	3.10 0.0015	3.09 0.0015	3.08 0.0015	3.07 0.0015	2.87 0.0015
1x1035	72.5%	Standard	0.0025	0.064	3.05 0.0014	3.04 0.0014	3.03 0.0014	3.02 0.0014	2.82 0.0014
1x1078	65.5%	Standard	0.0030	0.076	3.12 0.0015	3.11 0.0015	3.10 0.0015	3.09 0.0015	2.89 0.0015
1x1078	69.5%	Standard	0.0035	0.089	3.08 0.0014	3.07 0.0014	3.06 0.0014	3.05 0.0014	2.85 0.0014
2x1035	67.0%	Standard	0.0040	0.102	3.10 0.0015	3.09 0.0015	3.08 0.0015	3.07 0.0015	2.87 0.0015
1x1078	73.0%	Standard	0.0040	0.102	3.05 0.0014	3.04 0.0014	3.03 0.0014	3.02 0.0014	2.82 0.0014
2x1035	70.0%	Standard	0.0045	0.114	3.08 0.0014	3.07 0.0014	3.06 0.0014	3.05 0.0014	2.85 0.0014
2x1035	72.5%	Standard	0.0050	0.127	3.05 0.0014	3.04 0.0014	3.03 0.0014	3.02 0.0014	2.82 0.0014
2x1078	65.5%	Standard	0.0060	0.152	3.12 0.0015	3.11 0.0015	3.10 0.0015	3.09 0.0015	2.89 0.0015
2x1078	69.5%	Standard	0.0070	0.178	3.08 0.0014	3.07 0.0014	3.06 0.0014	3.05 0.0014	2.85 0.0014
2x1078	73.0%	Standard	0.0080	0.203	3.05 0.0014	3.04 0.0014	3.03 0.0014	3.02 0.0014	2.82 0.0014
3x1078	68.0%	Standard	0.0100	0.254	3.09 0.0015	3.08 0.0015	3.07 0.0015	3.06 0.0015	2.86 0.0015

Prepreg Data

Glass	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	10 GHz	15 GHz	20 GHz	30 GHz
Glass	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1035	67.0%	Standard	0.0020	0.051	3.10 0.0015	3.10 0.0015	3.10 0.0015	3.10 0.0015
1035	72.5%	Standard	0.0025	0.064	3.05 0.0014	3.05 0.0014	3.05 0.0014	3.05 0.0014
1035	76.5%	Standard	0.0030	0.076	3.02 0.0014	3.02 0.0014	3.02 0.0014	3.02 0.0014
1078	65.5%	Standard	0.0030	0.076	3.12 0.0015	3.12 0.0015	3.12 0.0015	3.12 0.0015
1078	69.5%	Standard	0.0035	0.089	3.08 0.0014	3.08 0.0014	3.08 0.0014	3.08 0.0014
1078	73.0%	Standard	0.0040	0.102	3.05 0.0014	3.05 0.0014	3.05 0.0014	3.05 0.0014
1078	76.0%	Standard	0.0045	0.114	3.02 0.0014	3.02 0.0014	3.02 0.0014	3.02 0.0014

NOTE

Revisions:
A-Original-3/23
B-Adjusted RC%, Dk and Df values to match test data -7/23
All TerraGreen 400G2 glass is Spread Weave in both directions
Standard-Commonly available
Alternate-Available, but not stocked
The Dk referred to as 30GHz D is extracted based on VNA measurements of coupled differential lines

Documentation ▼

Resource Title & Summary	Date Updated
TerraGreen® 400G Prepreg Safety Data Sheet	01/22/2024
TerraGreen® 400G Laminate Safety Data Sheet	08/23/2024
TerraGreen® 400G2 Processing Guide	01/09/2023
TerraGreen 400G Prepreg RoHS Declaration	03/20/2024
TerraGreen 400G Laminate RoHS Declaration	03/20/2024
TerraGreen® 400G Laminate Supplemental	03/20/2024
TerraGreen® 400G Prepreg Supplemental	03/20/2024

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials

First Name*
Last Name*
Email*
Region*
Company Name*
Job Title*
*
Country
Phone*
Zip Code*
ZIP / Postal Code
What type of assistance do you need?*
In your own words, please describe how we can help you.*
<a href="https://www.isola-group.com/privacy-policy/" target="_blank">Privacy Notice</a>*
- I have read and accept these terms
Isola needs the contact information you provide to us to contact you about our products and services. You may unsubscribe from these communications at any time. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, please review our Privacy Policy.
CAPTCHA

Top

Property		TerraGreen^® 400G2
Recommended for New Design
Halogen Free
Glass Transition Temperature (Tg) by DSC	Resin Content	200
Dk, Permittivity	Resin Content	3.07
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	>380
Df, Loss Tangent	Resin Content	0.0015
Moisture Absorption	Resin Content	<0.1
Z-Axis CTE	50 to 260°C, (Total Expansion)	1.8
Peel Strength	Standard profile copper >>> After thermal stress	0.7 (4.1)

TerraGreen® 400G2

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G2 laminate materials are our most advanced ultra-high speed, halogen free extremely-low loss design solution.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

Add a Product to Compare to TerraGreen® 400G2

Contact Our Team For Product Information

TerraGreen^® 400G2

Add a Product to Compare to TerraGreen^® 400G2