IS420

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IS420

Lead Free Epoxy Laminate and Prepreg

IS420 is a high performance 170°C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 170°C Td: 350°C	Dk: 4.04 Df: 0.021	IPC-4101 /98 /99 /101 /126 UL - File Number E41625

Thermal Performance

Tg: 170°C
Td: 350°C

Electrical Performance

Dk: 4.04
Df: 0.021

Industry Approvals

IPC-4101 /98 /99 /101 /126

UL - File Number E41625

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability.

In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging.

Attributes

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- Qualified to UL’s MCIL Program
- RoHS Compliant

Performance Attributes
- Lead-free assembly compatible

Processing Advantages
- FR-4 process compatible
- UV blocking and AOI fluorescence

Production & Manufacturing

Currently manufactured in Asia, Europe

Product Availability

Standard Material Offering: Laminate
- 2 to 93 mil (0.05 to 2.4 mm)

Copper Foil Type
- HTE Grade 3

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels

Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		170	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss		350	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	60 >15	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	45 230 2.8	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE	Pre-Tg	13/14	ppm/°C	2.4.24C
Thermal Conductivity		0.4	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	4.24 4.17 4.04 3.92 3.92	—	2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Df, Loss Tangent	A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	0.0150 0.0161 0.0210 0.0250 0.0250	—	2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Volume Resistivity	A. After moisture resistance B. At elevated temperature	3.0 x 10⁸ 7.0 x 10⁸	MΩ-cm	2.5.17.1
Surface Resistivity	A. C-96/35/90 B. After moisture resistance C. At elevated temperature	— 3.0 x 10⁶ 2.0 x 10⁸	MΩ	2.5.17.1
Dielectric Breakdown		>50	kV	2.5.6B
Arc Resistance		115	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		54 (1350)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		3 (175-249)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions	1.14 (6.5) 1.25 (7.0) 1.25 (7.0) 1.14 (6.5)	N/mm (lb/inch)	2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3
Flexural Strength	A. Length direction B. Cross direction	570 (82.7) 420 (60.9)	MPa (kpsi) ksi	2.4.4B
Moisture Absorption		0.15	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		130	°C	UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Added /126 slash sheet 02/20

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Constructions	Resin Content %	Thickness (inch)	Thickness (mm)	100 MHz	1 GHz	2 GHz	10 GHz
Constructions	Resin Content %	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x106	72%	0.002	0.050	4.30 0.1800	4.10 0.1800	3.95 0.0210	3.90 0.0240
1x1080	64%	0.003	0.075	4.65 0.0180	4.26 0.0180	4.15 0.0210	4.10 0.0230
1x2116	47%	0.004	0.100	4.60 0.0160	4.52 0.0160	4.35 0.0170	4.25 0.0170
1x2116	55%	0.005	0.125	4.75 0.0160	4.37 0.0160	4.25 0.0170	4.20 0.0170
1x1652	52%	0.006	0.150	4.75 0.0170	4.40 0.0170	4.25 0.0180	4.20 0.0190
1x7628	43%	0.007	0.175	4.90 0.0160	4.58 0.0160	4.45 0.0170	4.35 0.0170
1x7628	48%	0.008	0.200	4.85 0.0160	4.50 0.0160	4.40 0.0170	4.35 0.0180
2x2116	55%	0.010	0.250	4.75 0.0160	4.37 0.0160	4.25 0.0170	4.20 0.0170
2x1652	52%	0.012	0.300	4.75 0.0170	4.40 0.0170	4.25 0.0180	4.20 0.0190
2x7628	44%	0.014	0.360	4.90 0.0160	4.57 0.0160	4.45 0.0170	4.40 0.0170
2x7628	48%	0.016	0.410	4.85 0.0160	4.50 0.0160	4.40 0.0170	4.35 0.0180
3x1652	52%	0.018	0.460	4.75 0.0170	4.40 0.0170	4.25 0.0180	4.20 0.0190
3x7628	42%	0.020	0.510	4.91 0.0160	4.60 0.0160	4.45 0.0170	4.35 0.0170
3x7628	44%	0.021	0.540	4.90 0.0160	4.57 0.0160	4.45 0.0170	4.40 0.0170
3x7628	48%	0.024	0.610	4.85 0.0160	4.50 0.0160	4.40 0.0170	4.35 0.0180
4x7628	44%	0.028	0.710	4.90 0.0160	4.57 0.0160	4.45 0.0170	4.40 0.0170
4x7628	46%	0.030	0.760	4.87 0.0160	4.53 0.0160	4.42 0.0170	4.37 0.0180
5x7628	48%	0.039	1.000	4.85 0.0160	4.50 0.0160	4.40 0.0170	4.35 0.0180
6x7628	48%	0.047	1.200	4.85 0.0160	4.50 0.0160	4.40 0.0170	4.35 0.0180
8x7628	45%	0.058	1.460	4.89 0.0160	4.55 0.0160	4.46 0.0170	4.36 0.0170

Prepreg Data

Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	100 MHz	1 GHz	2 GHz	10 GHz
Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
106	72%	0.0020	0.051	4.30 0.0180	4.10 0.0190	3.95 0.0200	3.90 0.0240
106	76%	0.0024	0.060	4.28 0.0190	4.02 0.0200	3.87 0.0210	3.82 0.0250
1080	64%	0.0029	0.073	4.50 0.0170	4.30 0.0180	4.05 0.0190	4.00 0.0210
1080	70%	0.0035	0.090	4.38 0.0180	4.14 0.0190	4.00 0.0200	3.94 0.0240
2113	57%	0.0039	0.098	4.64 0.0170	4.40 0.0180	4.26 0.0180	4.20 0.0200
2116	52%	0.0046	0.116	4.74 0.0170	4.50 0.0170	4.36 0.0180	4.30 0.0190
2116	57%	0.0052	0.132	4.64 0.0170	4.40 0.0180	4.26 0.0180	4.20 0.0200
7628	45%	0.0074	0.187	4.85 0.0160	4.64 0.0160	4.50 0.0170	4.34 0.0180
7628	50%	0.0083	0.210	4.75 0.0170	4.54 0.0170	4.40 0.0170	4.24 0.0180

NOTE

Revisions:
A - Original 10/20

Documentation ▼

Resource Title & Summary	Date Updated
IS420 Prepreg Supplemental	03/20/2024
IS420 Laminate Supplemental	03/20/2024
IS420 Laminate Safety Data Sheet	01/22/2024
IS420 Prepreg Safety Data Sheet	02/26/2024
IS420 Laminate RoHS Declaration	03/20/2024
IS420 Prepreg RoHS Declaration	03/20/2024
IS420 Processing Guide	06/26/2020

Resources

Presentation

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

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Top

Property		IS420
Recommended for New Design
Halogen Free		—
Glass Transition Temperature (Tg) by DSC	Resin Content	170
Dk, Permittivity	Resin Content	3.92
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	350
Df, Loss Tangent	Resin Content	0.0250
Moisture Absorption	Resin Content	0.15
Z-Axis CTE	50 to 260°C, (Total Expansion)	2.8
Peel Strength	Standard profile copper >>> After thermal stress	1.14 (6.5)

IS420

Lead Free Epoxy Laminate and Prepreg

IS420 is a high performance 170°C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

Add a Product to Compare to IS420

Resources

Laminate & Prepreg Manufacturing

Contact Our Team For Product Information