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PCB-Substrate Characterization at Multigigahertz Frequencies Through SIW Measurements

New Low Dielectric Constant, High Tg, Printed Circuitry Substrates

Moisture Absorption Properties of Laminates Used in Chip Packaging Applications

Micro-sectioning of Laminates

Making Sense of Laminate Dielectric Properties

Lead Free Assembly: A Practical Tool For Laminate Materials Selection

Laminate Materials with Low Dielectric Properties

Laminate Materials for No-Lead Solder Applications

Signal Integrity Analysis Techniques Used to Characterize PCB Substrates

Improved High Speed, Low Loss Materials for Lead-Free Assembly Compatibility

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