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High Tg Bromine-free Laminates for PWB Applications
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Halogen Free Base Materials for PWB Applications
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Control of Key Registration Variables for Improved Process Yields on Dense MLBs
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Conductive Anodic Filament Growth Failure
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Coated Copper Foils for High Density Interconnects
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Characterizing Geometry-Dependent Crossover Frequency for Stripline Dielectric and Metal Losses
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Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
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New Developments in High Frequency Dielectric Measurements of PWB Materials Part II: Applications of the Bereskin Method to PWB Materials
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Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions
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An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
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