Laminate Materials For No Lead Solder Applications

Laminate Materials For No Lead Solder Applications

08 August 2016

Related Posts

Machining Materials Multi Circuits
Machining Materials for Multilayer Circuits
Electronic products continue to add functions in smaller packages, even for traditionally large systems such as computer servers and wired telecommunications networks. Multilayer circuits are essential for providing more electronic capabilities in smaller sizes, often relying on highly integrated circuits (ICs) and surface-mount-technology components to…
Press Release Cropped 190x95[1]
Isola Achieves IATF 16949:2016 Certification
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), today announced that it has achieved IATF 16949: 2016 certification for our Chandler, Arizona headquarters and our facilities in Dϋren, Germany, Huizhou and Suzhou,…
Isostack Tool Help – Right Panel
Check to select frequencies to calculate impedance. Check to highlight the copper layer of interest. Uncheck reference check box to designate a signal layer. By default, all layers are treated as a reference plane. 4. A ‘green’…