Predicting Dimensional Deformation During Lamination For Multilayer Printed Circuit Boards

Predicting Dimensional Deformation During Lamination For Multilayer Printed Circuit Boards

08 August 2016

Related Posts

Eumw Promo 2022 2
Isola to show unique RF and microwave circuit materials
At the European Microwave Exhibition in London, Isola will be providing guidance on the best use of its advanced circuit materials for printed circuit boards. Isola’s material experts and sales professionals, including new addition Jim Francey, will welcome visitors to learn about the optimum…
Pcbwest2022
Isola Highlights Advanced Materials for Hybrid Circuits at PCB West 2022
Smaller circuits with greater functionality are possible with the advanced circuit materials developed by Isola Group (www.isola-group.com) and being shown at the PCB West 2022 Exhibition on Wednesday, October 5, 2022 at the Santa Clara Convention Center in Santa Clara, CA. Combining laminate and…
PCB007 Interview with Travis Kelly: Isola Responding to the Market
PCB007 Interview with Travis Kelly: Isola Responding to the Market
Feature Interview by the I-Connect Editorial Team in July, 2021. Interview with Isola’s Travis Kelly overviewing many the important topics that the industry is facing, like how the global supply chain is being strained by materials, and what companies are trying to do to…