Predicting Dimensional Deformation During Lamination For Multilayer Printed Circuit Boards

Changing market conditions require changes in approach. I-Connect007’s Barry Matties and Nolan Johnson speak with Isola’s Travis Kelly, Sean Mirshafiei, and Kirk Thompson about Isola’s recent responses to market conditions. In this interview, Kelly, Mirshafiei…

As system complexity and performance requirements continue to rise, the materials that serve as the foundation for advanced printed circuit boards (PCBs) and packaging substrates play an increasingly critical role. At Isola, we are committed…