Thermal Reliability Of Laser Ablated Microvias And Standard Through Hole Technologies As A Function Of Materials And Processing
09 August 2016
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Isola Names New CFO
CHANDLER, Ariz., August 15, 2016 — Isola, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced that it has appointed Ken Rizvi as Chief Financial Officer, effective immediately. Rizvi succeeds Interim CFO Donald Colvin,…
Advancing Substrate Materials for Next-Generation Electronics: Isola’s Technical Commitment
As system complexity and performance requirements continue to rise, the materials that serve as the foundation for advanced printed circuit boards (PCBs) and packaging substrates play an increasingly critical role. At Isola, we are committed to advancing substrate technology that meets the stringent demands of…
Check to select frequencies to calculate impedance. Check to highlight the copper layer of interest. Uncheck reference check box to designate a signal layer. By default, all layers are treated as a reference plane. 4. A ‘green’…