Thermal Reliability Of Laser Ablated Microvias And Standard Through Hole Technologies As A Function Of Materials And Processing

Thermal Reliability Of Laser Ablated Microvias And Standard Through Hole Technologies As A Function Of Materials And Processing

09 August 2016

Related Posts

Pcbwest2022
Isola Highlights Advanced Materials for Hybrid Circuits at PCB West 2022
Smaller circuits with greater functionality are possible with the advanced circuit materials developed by Isola Group (www.isola-group.com) and being shown at the PCB West 2022 Exhibition on Wednesday, October 5, 2022 at the Santa Clara Convention Center in Santa Clara, CA. Combining laminate and…
Tpca Show Logo 6509
ISOLA TO EXHIBIT AT TPCA SHOW, OCTOBER 23-25, 2019
Press Release Cropped 190x95[1]
ISOLA APPOINTS SEAN MIRSHAFIEI AS NEW CHIEF SALES AND MARKETING OFFICER
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced it has promoted Sean Mirshafiei , formerly Vice President, Global Marketing, to Chief Sales and Marketing Officer. “Sean has over 20 years’ experience…